The 3DC14EM-ULP Series, the smallest in height (less than 50% of the parts in the market today). Most of the 3D-electromagnetic sensors in the market has a height around 3.2mm. The smallest height before ULP series was the PREMO 3DC06 invention, with 2.5mm. Ready to integrate in smartphones and other devices such as Key-fobs, smartcard-key-fob, and wearables.

The 1.65mm height target has been the biggest challenge during the last 2 years, achieving it by a joint ecosystem development effort between BQ, UC3M University and Premo. The whole project was under the scope of a CDTI Spain research project called ASUMP.

Read the complete press release.