3DC15-HF - Surface Mount 3D Coil for NFC Near Field Communication 13.56MHz / 3-18uH / 5.4x2.8x2.85mm

L (µH)Q MinHeight (mm)Length (mm)Width (mm)Freq. (kHz)DCR (Ω) MaxToleranceSRF (MHz) Min
3244.017.516.0135600.561±10%25
6204.017.516.0135600.737±10%25
9204.017.516.01356022±10%25
18154.017.516.01356010.12±10%25
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Characteristics

Surface Mount 3D Coil for NFC Near Field Communication

In the last few years, Communication technology by Near Field Communications (NFC) has experienced a lot of improvements. PREMO enlarges its NFC product range with the new 3DC15-HF series. A combination of 3 single coils oriented in the 3 space axis. The new 3D coil from PREMO RFID offers the possibility of mounting a single component instead of three, thus reducing cost, saving PCB space and increasing the circuit reliability. Sensitivity, low profile and small size are the key of this RFID innovative component. Best choice for keyless entry systems the three tri-rectangular windings ensure optimum field sensing regardless position. 
 
         
                 
  • Size: 17.5x16.0x4.0 mm
  • High drop test resistance (up to 500 times 1 m) due to a maximized pin area.
  • High stability in temperature (-40ºC to +85ºC).
  • Isotropic version available.
  • With cover cap or labelled.
  • Taped & Reeled.
  • Designed for 13,56MHz. 
 

Applications: 

  • NFC applications.
  
The specification chart is a reference guide for the most common required values at working frequencies of 13,56MHz. Any other inductance value at HF or tighter tolerances can be provided. Please contact our sales deparment for any inquiry.  
 

This product has a datasheet available upon request. 

L (uH)ToleranceQ MinQ z MinFrequency (kHz)DCR (Ω) MaxDCR z (Ω) MaxSRF (MHz) MinLength (mm)Width (mm)Height (mm)
3DC15HF-0003K 3 ±10% 24 18 13560 0.352 0.561 25 17.5 16.0 4.0
3DC15HF-0006K 6 ±10% 20 15 13560 0.506 0.737 25 17.5 16.0 4.0
3DC15HF-0009K 9 ±10% 20 10 13560 0.594 0.836 25 17.5 16.0 4.0
3DC15HF-0018K 1.8 ±10% 15 6 13560 0.836 1.012 25 17.5 16.0 4.0
Dimensions

Packaging

 

 

 

PAD LAYOUT

ELECTRICAL DIAGRAM

SOLDERING

Typical Operating Frequency 13,56MHz

Storage Temperature -40 ºC → +105 ºC

Operating Temperature -40 ºC → +85 ºC

Lead Free Reflow Profile