3DV09 - Low profile 3D magnetic Rx sensor for VR/AR 9.5x9.5x3.1mm

L (mH) MinDCR (Ω) MaxFreq. (kHz)Cres (pF)Q x,y,z MinHeight (mm)Width (mm)Length (mm)SRF (kHz) MinSensitivity (mV/uT) min
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Characteristics

Low profile 3D magnetic receiver sensor for VR magnetic tracking systems.

  • Small size 3D magnetic tracking sensor
  • SMD solution
  • Suitable for AOI
  • Inductance range: 2-9mH
  • Dimensions: 9.5 × 9.5 × 3.1 mm
  • Sensitivity (mV/A/m): 9

Lx,y,z nomQx,y,z min f (kHz)SRF x,y (kHz) MinSRF z (kHz) MinDCR x (Ohm) MaxDCR y (Ohm) MaxDCR z  (Ohm) MaxSensitivity x,y,z (mVpp/App/m) Min
3DV09-A-S0500J     5 (x,y) / 16 (z) mH 3 20 250 500 192.5 209 330.1 9 (x, y, z)
Dimensions

All Dimensions in mm. Pins Coplanarity 0.10mm. General Tolerances unless indicated ±0.1mm
Contact PREMO for more detailed information about pad layout.

Packaging

PAD LAYOUT

ELECTRICAL DIAGRAM

MEASUREMENT CONDITIONS

  • Typical Operating Frequency 20kHz
  • Storage Temperature -40 ºC → +85 ºC 
  • Operating Temperature -40 ºC → +85 ºC 
  • Lead Free Reflow Profile: 
  • Equivalent to test condition K from MIL-STD-202G, method 210F 
  • Component temperature 250±5 ºC. Time 30 ± 5 s. Temperature ramp/inmersion and emersion rate: 1ºC/s-4ºC/s. Time above 183 ºC: 90-120 s. 
Custom Product

A wide range of configuration possibilities

PREMO biggest competitive advantage is the short time-to-market performance when developing a custom-made solution according to customer specifics.

A wide variety of EM sensors can be designed to meet AR/VR systems requirements. From cube configurations to low-profile configurations, and from lower to higher sensitivities, the range of possibilities is very wide:

• Shapes (i.e. rectangular, quasi-cub, ultralow-profile)
• Inductance: Tx (20μH – 2mH), Rx(300μH – 7mH)
• Operation frequency (3 – 300kHz)
• Standard cables to male/female connector
• FPC connection
• Over-Molded (low pressure molding)