3DC06EM SMD Epoxy encapsulated 3D Coil 

New
SMD Epoxy encapsulated 3D Coil

Epoxy Encapsulated Features 

Smallest 3D coil in the market epoxy encapsulated. Newer designs in KES and mobile applications require smallest sizes in this passive component and still a long reading distance together with higher reliability. 3DC06EM offer upgraded possibilities due to the extra protection that the Epoxy molding gives.

                         

Characteristics

- Size 7.9x7.9x2.45 mm
- SMD solution
- Suitable for AOI
- High stability in temperature (-40
ºC to +85 ºC)
- P&P operations allowed
- Same sensitivity in the three axis.

                        

               

L x,y,z nom

Qx,y,z nom

F (kHz)SRF x,y (kHz) MinSRF z (kHz) MinDCR x (Ohm) MaxDCR y (Ohm) MaxDCR z (Ohm) MaxSensitivity x,y,z (mV/A/m) Min (*)
3DC06EM-S0345J     3.45 / 3.45 / 10.5 mH 12/12/20 125 500 750 140 150 345 30

 (*) Ask for sensitivity test set up and recommendations

Electrical Diagram passive component

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