3DC06EM SMD Epoxy encapsulated 3D Coil

Product
3DC06EM-S0345J
Epoxy Encapsulated Features  Smallest...
5,00 €
Out of stock
L (mH) MinDCR (Ω) MaxFreq. (kHz)Cres (pF)Q x,y,z MinHeight (mm)Width (mm)Length (mm)SRF (kHz) MinSensitivity (mV/uT) min
1252.457.97,9
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Characteristics

Epoxy Encapsulated Features 

Smallest 3D coil in the market epoxy encapsulated. Newer designs in KES and mobile applications require smallest sizes in this passive component and still a long reading distance together with higher reliability. 3DC06EM offer upgraded possibilities due to the extra protection that the Epoxy molding gives.

                         

Characteristics

- Size 7.9x7.9x2.45 mm
- SMD solution
- Suitable for AOI
- High stability in temperature (-40
ºC to +85 ºC)
- P&P operations allowed
- Same sensitivity in the three axis.

                        

               

L x,y,z nom

Qx,y,z nom

F (kHz)SRF x,y (kHz) MinSRF z (kHz) MinDCR x (Ohm) MaxDCR y (Ohm) MaxDCR z (Ohm) MaxSensitivity x,y,z (mV/A/m) Min (*)Length (mm)Width (mm)Height (mm)
3DC06EM-S0345J    3.45 / 3.45 / 10.5 mH12/12/20125500750140150345307,97,92,45

 (*) Ask for sensitivity test set up and recommendations

Dimensions

PAD LAYOUT

ELECTRICAL DIAGRAM

Electrical Diagram passive component