CS0805F CERAMIC CHIP INDUCTOR 0805 HIGH Q (2.2NH-1000NH)

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其它 - 陶瓷贴片射频电感 - CS0805F Ceramic Chip Inductor 0805 High Q (2.2nH-1000nH)

Soldering:

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Chip inductor Reflow

  • Reflow soldering, vapour-phase soldering.
  • Recommended Peak Temperature 250ºC Max.
  • 250ºC up /within 10 secs.
  • Gradient of temperature rise: av 1-4ºC/sec.
  • Preheat: 160-190ºC/within 90-120 secs.
  • Composition of solder Sn-3Ag-0.5Cu.

 

 

 

 

 

 

 

 

The reflow profile will depend on the oven and solder paste used. We recommend to test different reflow curves and choose the one which fits all component & process requirements.