- Reflow soldering, vapour-phase soldering.
- Recommended Peak Temperature 250ºC Max.
- 250ºC up /within 10 secs.
- Gradient of temperature rise: av 1-4ºC/sec.
- Preheat: 160-190ºC/within 90-120 secs.
- Composition of solder Sn-3Ag-0.5Cu.
The reflow profile will depend on the oven and solder paste used. We recommend to test different reflow curves and choose the one which fits all component & process requirements.